Geplaatst: 4 juni 2026

Aixtron Black Magic

CVD system for Carbon nanotube and Graphene deposition. It can also be used for alloying Cu-contaminated wafers.
Special permission and training are required to work with nano-particles.

Geplaatst:

Geplaatst:

Adixen AMS110 → Single wafer multi purpose etcher.

Reactor type: 1 coil ICP, equipped with 2 HF RF generators
Process modes: DRIE (Bosch), ICP-RIE (anisotropic), RIE (anisotropic), ICP (isotropic)
Available gasses: SF6, C4F8, O2, Ar, He, CH4
Etch capabilities: Si (Bosch DRIE process or isotropic), SiO2, TEOS, SiN
Wafer clamping: Electrostatic
Classification: Contaminated (not C-MOS compatible)

Geplaatst: 28 mei 2026

Tepla Plasma 300 → Photoresist asher and surface treatment system.

Reactor type: Barrel
Available gasses: O2, Ar, CF4
Available options: Faraday cage
Classification: Contaminated (not C-MOS compatible)

Geplaatst: 2 mei 2026

The DWL 2000 laser lithography system is a fast and flexible, high resolution pattern generator for mask making and direct writing. With a write area of up to 200 x 200 mm2 .