AJA_MB

E-beam evaporation of metals:
-Ti (Titanium) – up to 50 nm (max 1Å/s)
-Pt (Platinum) – up to 200 nm (max 1Å/s)
-Pd (Palladium) – up to 200 nm (max 2Å/s)
-Ir (Iridium) – up to 20nm (max 1Å/s)

Deposition under an angle possible

Argon Ion milling in the Loadlock

Samplesize: Small samples up to 4 inch wafer, maximum thickness ~ 3 mm.