
E-beam evaporation of metals:
-Ti (Titanium) – up to 100 nm (max 2Å/s)
-Pd (Palladium) – up to 200 nm (max 2Å/s)
-Au (Gold) – up to 300 nm (max 2Å/s)
-Co (Cobalt) – up to 200 nm (max 1Å/s)
-Cr (Chromium) – up to 100 nm (max 2Å/s)
Deposition under an angle possible
Sputtering of Metals:
– Au (Gold) – up to 200nm (~20nm/min)
Argon Ion milling in the Loadlock
Samplesize: Small samples up to 4 inch wafer, maximum thickness ~ 3 mm.
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