E-Flex

Electron Beam Physical Vapor Deposition or EBPVD

– Polyteknik Flextura M508 E
– Sample size diameter 4” max 4mm thick
– Load lock with seperate turbo-pump
– Base pressure ~10-8 mbar (high vacuum; 400 l/s turbo, dry roughing pump)
– Ar etching gas, reactive gas evaporation with N2 and O2
– E-beam 10 kV, 500 mA evaporation source with 8 rotatable crucibles
– 2 thermal sources
– Co-evaporation
– Source to substrate distance 500mm
– 2 Quartz thickness monitors
– Sample heating till 400 °C
– Sample rotation, 360°
– Shutter system for sources and sample
– Linear shutter 100mm resolution 10µm
– Automated recipe driven software