Idonus Vapor HF

The Idonus Vapour HF is a system for the vapour-phase etching of silicon dioxide layers.

HF evaporates at room temperature and the etching of silicon oxide starts spontaneously. The wafer temperature controls the etch rate, which can be adjusted from 35ºC to 60ºC. Wafer clamping can be achieved by electrostatic clamping. Both, single chips (larger than 5 mm x 5 mm) and full wafers can be clamped electrostatically to the heating element.