Oxford Instruments PlasmaPro 100 Cobra

The Oxford Instruments PlasmaPro 100 Cobra is a dual-source (inductively coupled plasma (ICP) + capacitively coupled plasma (CCP)) reactive ion etching (RIE) system. The Cobra is intended for etching thin films of metals and dielectrics using chlorine-, bromine- and fluorine-based plasmas. This flexible, load-locked plasma etcher is provided with Ar, O2, SF6, CHF3, CF4, Cl2, BCl3, and HBr.

Features include:

• Continuous mechanical quartz clamping with He backside cooling.
• Ideal sample size: 100 mm wafers with primary flat.
• 3 kW ICP generator.
• 300 W HF CCP platen generator.
• Single-wafer load-lock.