Oxford Instruments PlasmaPro 100 Estrelas

The Oxford Instruments PlasmaPro 100 Estrelas is a dual-source (inductively coupled plasma (ICP) + capacitively coupled plasma (CCP)) deep reactive ion etching (DRIE) system. It is designed for Bosch-based processes for high aspect ratio silicon etching (AR~30) using SF6/C4F8 plasmas, cryogenic etching using an SF6/O2 plasma, and unswitched pseudo-Bosch processes for high-precision 3-D nano-shaping of silicon using an SF6/C4F8 plasma.

Features include:

• Continuous mechanical quartz clamping with He backside cooling.
• Ideal sample size: 100 mm wafers with primary flat.
• ICP generator: 5 kW / 2 MHz. (max allowed ICP power: 4kW)
• CCP platen generators: 300 W HF (13.56 MHz) & 300 W LF (350 kHz, fixed pulsation at 200 Hz and 30% duty cycle)
• LN2 cooled platen and platen heater (available temperature range –120°C up to 100°C).
• Single-wafer load-lock.