Wafer bond system by EVG, the EVG510 bond system.
Bonding tool for Si and MEMPAX wafers by means of high temperature, high voltage and pressure (anodic bonding). Parameter range: temp max. 450 C, bonding voltage 0-2000 V/ 50 mA, pressure up to 20 kN.
MESA+ Institute
Hallenweg 15, 7522 NH
Enschede, The Netherlands
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