FC2000 evaporator

Electron beam evaporator.
Available materials: Ti, Pt, Au, Cr, Ni, Ge, Ag and Al.

Maximum thickness per material for evaporation: 300nm for most materials, 60nm for Cr.

Supported substrate sizes:

1. multiple piece parts,
2. up to three 2 inch wafers,
3. up to six 3 inch wafers,
4. up to four 100mm wafers.

March/April 2023 an Ar ion sputter gun was installed for pre-cleaning the sample surface, to improve adhesion and contact resistance.