TCOater – magnetron sputtering machine

TCOater is a research tool with an extensive range of capabilities: reactive deposition, co-deposition, RF/DC, substrate heating(max. 400°C), adjustable substrate-magnetron distance and software to define up to eight different process steps (layers).

System features:
– High vacuum load lock
– 4x 2-inch magnetrons diagonal to substrate
– 1x 4-inch magnetrons perpendicular/eccentric to substrate
– 2x DC power supply
– 2x RF power supply
– Baratron, Pirani, Penning gauges
– Pressure controlled throttle valve
– 3x argon mass flow controller
– 1x oxygen mass flow controller
– 1x nitrogen mass flow controller

Substrate dimensions:
– Sample size: 100 mm wafer

Oxide and nitride materials can be grown by reactive sputtering of single-element targets. Compound targets such as SiO2 have to be sputtered in argon and oxygen to obtain a fully oxidized film.

Co-sputtering can be used to grow alloys and doped films. Ratios can be tuned by adjusting discharge power per magnetron.