Tempress Systems Omega Jr | B4 – Glass bonding and annealing

Low-temperature furnace for in-line compatible processing (ILP). Temperature range: 400 – 650 °C.
Substrates/materials processed in this furnace cannot go into any other furnace system!

Use this furnace for:

• glass-glass and glass-silicon bonding
• densification ILP metals
• annealing of Al2O3 (rare earth doping)