Geplaatst: 27 februari 2026

LatticeAx® 420 delivers a cleaving accuracy of 10-μm in <5 min making it ideal for the lab that values speed and high accuracy while at the same time needing to accommodate a variety of sample sizes, thicknesses and materials (Si, GaAs, InP).  The patent pending LatticeAx base is integrated with a complete vision package that includes a monocular microscope with 4-μm optical resolution, color CCD camera and real-time image acquisition and display software, and an X-Y stage.  This dedicated cleaving workstation is designed so any user can used to survey, align, micro-indent, cleave, and inspect processed samples.