Geplaatst: 19 september 2026

(Reactive)(Co-) Evaporation using e-beam of:
Ti , TiNx, TiOx (0,5 – 2 A/s)
Al, AlOx (0,5 – 2 A/s)
Nb, NbN, NbOx (0,5 – 2 A/s)
Ta, TaN, TaOx (0,5 – 2 A/s)
Ag, (0,5 – 2 A/s)
Au,
Pd, (0,5 – 2 A/s)
Pt, (0,5 – 2 A/s)
Ge, (0,5 – 1 A/s)
Ni,
Co, (0,5 – 1 A/s)
Fe,
NiFe, (0,5 – 2 A/s)
Cr, (0,5 – 1 A/s)
NiCr,

Geplaatst: 23 april 2026

TOPdamper is an adaptive single-wafer evaporator system. The load lock – reactor design allows for high throughput and adaptability with custom tooling.

System features:
– Load lock
– 8 pocket e-beam evaporator
– Thermal evaporator
– End-hall ion source
– Pirani, Bayard-Alpert vacuum gauges
– Argon mass flow controllers

Substrate dimensions:
– Standard holders for 4” and 6” available
– Fully compatible with smaller substrates

Allowed Materials:
– Al, Ag, Au Al2O3, Ti, Cr, Pt, Pd, Co, Ni, B. Others may be approved by the admin.

Geplaatst:

The BAK 600 is an e-beam evaporator for deposition of various materials under high vacuum conditions. The evaporator uses a high voltage electron beam for resistive heating of materials. Up to four different materials can be deposited without breaking vacuum.

System features:
– Rotation symmetric wafer mounting
– Electron gun with 4 pockets, standard layout: aluminium, chromium, gold, platinum
– Quartz crystal mass balance for deposition rate measurement
– Oil diffusion pump
– Pirani and penning vacuum gauges
– 1x mass flow controller for glow discharge processes

Substrate dimensions:
– 16x 100mm wafers
– 8x 150mm wafers

Geplaatst: 17 maart 2026

FC-2000 Fast Cycle Temescal thin film evaporator 6 kW / eight pockets / long path

Geplaatst: 14 maart 2026

E-beam evaporation of metals;
Argon Ion milling in evaporation chamber.

Sample size: small samples up to multiple 4 inch wafers (13)
Thickness limitation: 20 nm except for Au and Al (exceptions can be granted, but only if you stop by)