Geplaatst: 14 maart 2026

E-beam evaporation of metals;
Argon Ion milling in evaporation chamber.

Sample size: small samples up to multiple 4 inch wafers (13)
Thickness limitation: 20 nm except for Au and Al (exceptions can be granted, but only if you stop by)

Geplaatst:

Evaporator with oxidation chamber, kaufmann source substrate cleaning, substrate L N2 cooling.
Thickness rules for Plassys: no more than 200 nm of deposition total on a single sample.

Geplaatst:

E-beam evaporation of metals:
-Ti (Titanium) – up to 100 nm (max 2Å/s)
-Pd (Palladium) – up to 200 nm (max 2Å/s)
-Au (Gold) – up to 300 nm (max 2Å/s)
-Co (Cobalt) – up to 200 nm (max 1Å/s)
-Cr (Chromium) – up to 100 nm (max 2Å/s)
Deposition under an angle possible

Sputtering of Metals:
– Au (Gold) – up to 200nm (~20nm/min)

Argon Ion milling in the Loadlock

Samplesize: Small samples up to 4 inch wafer, maximum thickness ~ 3 mm.

Geplaatst:

E-beam evaporation of metals:
-Ti (Titanium) – up to 50 nm (max 1Å/s)
-Pt (Platinum) – up to 200 nm (max 1Å/s)
-Pd (Palladium) – up to 200 nm (max 2Å/s)
-Ir (Iridium) – up to 20nm (max 1Å/s)

Deposition under an angle possible

Argon Ion milling in the Loadlock

Samplesize: Small samples up to 4 inch wafer, maximum thickness ~ 3 mm.

Geplaatst: 27 februari 2026

Temescal FC2000 electron beam evaporator.
Available materials: Ti, Pt, Au (later Pd and Nb will be added)

Supported substrate sizes:

1. multiple piece parts,
2. up to three 2 inch wafers,
3. up to six 3 inch wafers,
4. up to four 100mm wafers.

The system has a build in Ar ion sputter gun for pre-cleaning the sample surface, to improve adhesion and contact resistance.