Geplaatst: 16 juni 2026

PAS5500 /1100B ArF (193 nm) Scanner
Configured for 100mm wafers (4 inch)

Resolution: 100 nm
Single Machine Overlay accuracy: 15 nm

Interfaced with DUV Track
Standard DUV Stack: ~38 nm BARC / ~225 nm Resist / ~90 nm TARC

Geplaatst: 15 april 2026

Exposure tool for photoresist with UV light (Near UV range LED i-line or g-h-i-lines).
Hard and vacuum contact, flood or proximity exposure. Front to backside alignment.
Pre-alignment option for wafer bonding (anodic, Si-direct).

Geplaatst:

Exposure tool with Displacement Talbot Lithography (DTL) technology.
To produce sub-micron dimensioned periodic lines or holes.
Any (thin) resist that is sensitive for near-UV can be used.
A mask with submicron structures has to be supplied by the user.
Alignment is possible.

Geplaatst: 14 april 2026

Maskless Direct Laser Writing aligner tool from Heidelberg Instruments.
Contains two laser sources:
– 375 nm laser
– 405 nm laser
Minimum substrate size is 5 * 5 mm2
Maximum substrate size is 6 inch (mask)

Geplaatst: 17 maart 2026