Geplaatst: 4 juni 2026

Aixtron Black Magic

Aixtron Black Magic


CVD system for Carbon nanotube and Graphene deposition. It can also be used for alloying Cu-contaminated wafers.
Special permission and training are required to work with nano-particles.


Geplaatst: 2 mei 2026

Picosun Reactor-2

This Plasma Enhanced Atomic Layer Deposition (PEALD) system is for growth of metal nitride films.
Standardly double sided (conformal) deposition, back side may be protected using a carrier.

System features:
– High vacuum load lock (R1)
– RF plasma source adjustable from 100W to 3000W
– Reactor temperature: 200°C to 500°C
– Precursor lines: 3x heated, 3x non heated, 4x gases

– Ellipsometry ports for in situ analysis
– Argon carrier gas

Substrate dimensions:
– Sample size 4, 5, 6 inch wafers (no carrier needed)
– Compatible with smaller samples when using a carrier


Geplaatst: 23 april 2026

TCOater – magnetron sputtering machine

TCOater is a research tool with an extensive range of capabilities: reactive deposition, co-deposition, RF/DC, substrate heating(max. 400°C), adjustable substrate-magnetron distance and software to define up to eight different process steps (layers).

System features:
– High vacuum load lock
– 4x 2-inch magnetrons diagonal to substrate
– 1x 4-inch magnetrons perpendicular/eccentric to substrate
– 2x DC power supply
– 2x RF power supply
– Baratron, Pirani, Penning gauges
– Pressure controlled throttle valve
– 3x argon mass flow controller
– 1x oxygen mass flow controller
– 1x nitrogen mass flow controller

Substrate dimensions:
– Sample size: 100 mm wafer

Oxide and nitride materials can be grown by reactive sputtering of single-element targets. Compound targets such as SiO2 have to be sputtered in argon and oxygen to obtain a fully oxidized film.

Co-sputtering can be used to grow alloys and doped films. Ratios can be tuned by adjusting discharge power per magnetron.


Geplaatst:

T´COathy – magnetron sputtering machine

T’COathy is a sputter coater dedicated to deposition of noble metals: Au, Pt and refractory metals: Cr, Ta and Ti. The standard target layout and user-friendly software allow for easy operation and very short lead time.

System features:
– Load lock
– 2x 2-inch magnetrons perpendicular wrt substrate for Au and Pt
– 3x 2-inch magnetrons diagonally wrt substrate for Cr, Ta, Ti
– 1x DC power supply with a switch
– Baratron, Pirani, Bayard-Alpert vacuum gauges

Substrate dimensions:
– Maximum sample size 100 x 100 x 3 mm
– Compatible with smaller samples


Geplaatst:

Sputterke – magnetron sputtering machine

Sputterke is a multipurpose sputter coater for deposition of conductive materials.

System features:
– Load lock
– 3x 2-inch magnetrons with eccentric alignment to the substrate
– 1x DC power supply with a switch
– Pirani, Penning vacuum gauges
– 1x argon mass flow controller, reactor inlet

Substrate dimensions:
– Maximum sample size 100 x 100 x 6 mm
– Compatible with smaller substrates