Geplaatst: 11 maart 2026

The Memsstar Orbis Alpha XeF2 vapour-phase etcher is a system to etch silicon in a continuous and isotropic (conformal) manner and it is equipped with the high-selectivity module. Therefore, this system is suited for conformal etching of three-dimensional structures in silicon while using silicon oxide or silicon nitride as a masking material. It replaced our old pulsed XactiX e1 series XeF2 system as the Memsstar system showed superior results in terms of etch rate, etch uniformity (both planar and in three-dimensional structures), and selectivity towards frequently used mask materials.

The etch is strongly depending on mask design, layer thickness, confinement, and type of silicon. Therefore, all processing is done in collaboration with Henk-Willem Veltkamp!

System features:

• Connected gases: N2 and H2 (XeF2 is stored in a bubbler, through which N2 flows as carrier gas).
• Temperature controlled pedestal (25°C).
• Etch monitor based on SiF4 absorption spectroscopy.

Geplaatst:

The Idonus Vapour HF is a system for the vapour-phase etching of silicon dioxide layers.

HF evaporates at room temperature and the etching of silicon oxide starts spontaneously. The wafer temperature controls the etch rate, which can be adjusted from 35ºC to 60ºC. Wafer clamping can be achieved by electrostatic clamping. Both, single chips (larger than 5 mm x 5 mm) and full wafers can be clamped electrostatically to the heating element.

Geplaatst: 27 februari 2026

A single-wafer process tool that offers low-cost, controlled vapor phase, sacrificial oxide etching.

Geplaatst: 26 februari 2026

Xenon Difluoride Etching System
Homebuilt system
XeF2 etcher is a system to expose Si samples to XeF2 gas.

The etching is selective
Si : SiO2 => 500 : 1
Si : Si3N4=> 100: 1