In the past few months and the coming months, some new systems and facilities have been – or will be – installed in the cleanroom of the MESA+ NanoLab in Twente. Please see the text below for more details about these systems and whom to contact if you want to know more.
The system can handle dicing-frames and all substrate-sizes upon 9”. The thickness is restricted to 2mm in combination with a dicing-frame, and 7 mm from the bottom of the substrate-holder. Intensity in the range 20 mW/cm2 to 180 mW/cm2.
Contact for more information: Huib van Vossen
4K High Accuracy digital microscope capable of capturing high resolution images and measurement data for inspection and failure analysis.
Contact for more information: Huib van Vossen
Upgrade 1: laser replacement and PP-Gt to PP-GT+ (incl. large-scale option with 10X objective). Upgrade 2: Heteromerge MERGE ONE
Contact for more information: Huib van Vossen
Cassette-to-cassette automated system for spin coating or developing of positive photoresists.
Contact for more information: Huib van Vossen
The NanoLab acquired a Memsstar Orbis Alpha XeF2 silicon etcher equipped with the high-selectivity module. This system allows conformal etching of silicon while using silicon oxide or silicon nitride as masking material. It will replace the XactiX e1 series XeF2 system, as the Memsstar system showed superior results in terms of etch rate, etch uniformity (both planar and in three dimensional structures), and selectivity towards frequently used mask materials.
Contact for more information: Henk-Willem Veltkamp
Step height measurements, sample size range 1×1 cm to 200 mm, unstitched scan length 50 cm, max step height 900 µm.
Contact for more information: Corné Heeren
Additional system for RTP, processing gasses will be O2, N2 and forming gas.
Contact for more information: Gerard Roelofs
This new stack will contain 4 furnaces for hightemperature processes, of which 2 are dedicated to LPCVD processing (i.e. poly-Si, a-Si and SiRN (50 MPa)) and 2 to atmospheric processing (i.e. wet oxidation and fluorocarbon ashing).
Contact for more information: Gerard Roelofs
Due to aging of the current Ionfab 300Plus, a new IBE/RIBE system is ordered. During the tender procedure, Oxford Instruments showed to be able to fulfil our needs. Therefore, the new system is again an Ionfab 300. The new system will, besides the current IBE with Ar and RIBE with Ar/O2, also be able to perform slanted RIBE of silicon using SF6/CHF3.
Contact for more information: Henk-Willem Veltkamp
